UV laser marking machine introduction

UV laser marking machine adopts 355nm laser source and the third-order cavity frequency doubling technology. Compared with infrared laser, UV laser has smaller spot light and it can reduce the workpiece mechanical deformation during processing. It’s mainly used for ultra-fine marking or engraving. It is suitable for food marking, medical or plastic packaging marking, micro hole marking, glass high-speed division and silicon wafer graphics cutting.

• laser spot, fine marking lines, unique marking effect, never wear off, anti-falsification;
• Adopt intravenous injection frequency technology, greatly improving the stability of laser;
• 355nm Ultraviolet laser device as the light source. Narrow pulse widths and smaller thermal effects contribute to peak power. The higher the peak power, the wider range of the material adaptation;
• Higher pulse stability, that means better laser pulse consistently produces the same marking effect. Higher pulse repetition frequency to meet the needs of fast marking and high productivity;
• Photoelectric conversion efficiency, long service life;
• CAD, PLT, BMF, AI, JPG, DXF format signs and graphics can be supported;
• Automatically mark the date, bar code and two-dimensional code can be supported;
• Intelligent software integrated control, only by the key and emergency stop switch operation;
• 24 hours continuous operation to meet the needs of online or offline industrial production.

Applications
• Flexible circuit board (FPC) marking, cutting
• Micro hole machining
• Wafer scribing
• Non removal of metal surface
• Fine marking, a variety of polymer materials, marking and micromachining